국립창원대학교 G-램프(LAMP)사업단

Overview

• A state-of-the-art cleanroom facility for semiconductor and nano device processing. It serves as a collaborative nano-material research platform by integrating newly in stalled equipment and previously existing instruments f or nano fabrication and semiconductor processing.

Lab Images

Available Equipment

No. 1

RF Sputtering System

Location

• Cleanroom, 3rd Floor, Building 7 (Shared Core Facility for Research and Training)

Specifications

• Supports up to 8-inch silicon wafers (6-inch, 4-inch, and fragment wafers), substrate heater up to 800℃ (substrate temperature), 3 sputtering cathodes, target utilization efficiency over 55%

Description

• A system that uses RF power in vacuum to remove atoms from a material surface and deposit them as a thin film onto a substrate

Applications

• Thin film deposition and fabrication for industries such as semiconductors, displays, optics, advanced materials, solar cells, sensors, and medical devices

No. 2

Inductively Coupled Plasma Reactive Ion Etching (ICP-RIE)

Location

• Cleanroom, 3rd Floor, Building 7 (Shared Core Facility for Research and Training)

Specifications

• ICP source, supports 6-inch wafers, temperature control from -10℃ to 200℃, cylinder type for 6-inch wafers, forced air or water cooling

Description

• A system that selectively removes unwanted thin film areas based on circuit patterns formed on semiconductor wafers

Applications

• Used in etching processes for semiconductors, displays, MEMS (Micro-Electro-Mechanical Systems), and LED manufacturing

No. 3

Mask Aligner

Location

• Cleanroom, 3rd Floor, Building 7 (Shared Core Facility for Research and Training)

Specifications

• Wavelength range: 350–450 nm, max beam size: 6×6 inches, dual CCD zoom microscope
• Resolution: vacuum contact ≤ 2 µm (PR thickness 1 µm), hard contact ≤ 3 µm, soft contact ≤ 5 µm

Description

• A system that prints circuit patterns onto wafers using photomasks as templates

Applications

• Utilized in precision patterning for semiconductors, displays, MEMS, PCB (Printed Circuit Board) manufacturing, and R&D applications